5 edition of Electrical Performance of Electronic Packaging found in the catalog.
by Institute of Electrical & Electronics Enginee
Written in English
|The Physical Object|
|Number of Pages||377|
About the Journal. The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems. Materials for Electronic Packaging examines the interconnections, encapsulations, substrates, heat sinks and other components involved in the packaging of integrated circuit chips. These packaging schemes are crucial to the overall reliability and performance of electronic systems.
Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly. Book Description. The packaging of electronic devices and systems represents a significant challenge for product designers and managers. Performance, efficiency, cost considerations, dealing with the newer IC packaging technologies, and EMI/RFI issues all come into play. Many of the formal technical publications of the NASA Glenn Smart Sensors and Electronics Systems Branch are listed in the below table. These technical publications are posted on this site in order to ensure timely public dissemination of NASA technical work.
Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and : $ Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture. Madhavan Swaminathan is the John Pippin Chair in Electromagnetics in the School of Electrical and Computer Engineering (ECE) and Director of the 3D Systems Packaging Research Center (PRC) at Georgia Tech. He formerly held the position of Joseph M. Pettit Professor in Electronics in ECE and Deputy Director of the NSF Microsystems Packaging Research Center, Georgia Tech. Prior.
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